In the future, the case will completely lack any connectors, ports, and holes - all peripheral devices will be connected wirelessly. It will be applied to all branded devices.

Broad support for wireless and radio interfaces - infrared IR, Bluetooth and proprietary technology similar to Bluetooth, Wireless USB, Wi-Fi and Micro-power Wi-Fi, Li-Fi (based on optical light radiation), the radio channel for the Internet of things IoT, GSM 5G, SAT satellite communications (without external antenna, communication directly with a satellite without using ground-based infrastructure, communication quality is not worse than 5G), NFC and contactless payment system technology, proprietary satellite positioning technology (with support for existing GNSS navigation technologies, centimeter positioning accuracy, navigation in buildings and tunnels). It will be applied to all branded devices.

eSIM – electronic SIM card. It will be applied to all branded devices.

The front-facing camera and sensors are placed directly behind the screen - in this way, it will be possible to realize a frameless display without any cutouts. It will be applied to all branded devices.

The passive cooling system will ensure absolutely quiet work, high reliability, and high-quality heat outflow, users will be able to comfortably work with the laptop even in extremely hot conditions, and at the same time, the laptop case will heat up no higher than 37 0С (98,6 °F).

The touchpad is as good to use as the Apple MacBook.

Keyboard - the backlight does not get out from under the keys if you look at them at an angle (which is exactly how we interact with the keyboard), only the symbols on the buttons are lit. Each mechanical key is presented in the form of an LED display (e-ink technology, color, and monochrome) - you can display a different language layout, symbols, and color images, and you can change the backlight and color of the keys (all or selectively), set your keyboard layouts (gestures, symbols, letters). In the upper part of the keyboard (above the keys) there is an additional touch-information screen (interactive display with virtual controls), made using the e-paper technology, working in two modes: monochrome and color. In the future, a keyboard with a magnetic levitation mechanism Maglev Keyboard - the user will be able to adjust the strength of the resistance and response of the keys, the height of the keys, and the sound made when pressed. Spill protection.

Self-healing disinfecting case and screen, touchpad, and keyboard - removes greasy traces of fingerprints, bacteria and viruses, and chemical pollutants. It will be applied to all branded devices.

Stand-legs - retractable support at the bottom of the laptop case. Allows you to give the laptop a position that is more convenient for working on the keyboard and improves ventilation. The drive is automatic.

Future technologies (chip and board manufacturing technologies, chip manufacturing processes, new materials) will allow to production more advanced (chips, boards, equipment), faster, with fewer signal delays, lower power consumption, more compact (reduce the size), lighter, with almost zero heat, will reduce the manufacturing process of less than 2 nm, extend the Moore's law, cheaper in production. All custom-made chips and electronic components, boards and connecting wires (chip and interchip) will be made of special materials. The use of optical signal transmission technology (chip and interchip) will significantly increase the speed of information transfer and reduce energy consumption, by using light instead of electric current. It will be applied to all branded devices.